BERGQUIST GAP PAD TGP 10000ULM

BERGQUIST GAP PAD TGP 10000ULM is a soft gap pad filler with an ultra-low modulus (ULM) and exceptional thermal conductivity of 10.0W/m-K.
BERGQUIST® GAP PAD TGP 10000ULM is designed for high-performance applications and provides excellent wet-out at the interface characteristics due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.

FEATURES AND BENEFITS

• Thermal Conductivity: 10 W/m-K
• High compliance, low compression stress
• Ultra-low modulus