BERGQUIST GAP PAD TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with
stepped topography, rough surfaces, and high stack-up tolerances.
BERGQUIST GAP PAD TGP 2000 is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly. The material is supplied with protective liners on both sides.
The top side has reduced tack for ease of handling.
FEATURES AND BENEFITS
|Dielectric Breakdown Voltage||5000.0 Vac|
|Dielectric Constant, @ 1kHz||6|
|Heat Capacity, ASTM E1269||0.6 J/g-K|
|Operating Temperature||-60.0 - 200.0 ℃|
|Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00||30|
|Standard Thickness||0.508 - 3.175 mm|
|Thermal Conductivity||2.0 W/mK|
|Volume Resistivity||1x10 Ohm m|