BERGQUIST GAP PAD TGP 2101SF is a silicone-free, high-performance, thermally conductive gap-filling material.
The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive applications.
BERGQUIST GAP PAD TGP 2101SF is reinforced for easy material handling and added durability during assembly.
BERGQUIST GAP PAD TGP 2101SF offers exceptionally low interfacial resistances to adjacent surfaces and is constructed using a 1 mil polyester film on one side and natural tack on the other.
The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly.
FEATURES AND BENEFITS
|Operating Temperature||-60.0 - 125.0 °C|
|Standard Thickness||0.254 - 3.175 mm|
|Thermal Conductivity||2.0 W/mK|
|Young's Modulus, ASTM D575||228.0 KPa (33.0 psi )|