BERGQUIST GAP PAD TGP 2202SF is a high-performance, 2.0 W/m-K, thermally conductive gap-filling material.
The BERGQUIST GAP PAD TGP 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
BERGQUIST GAP PAD TGP 2202SF is specifically designed for silicone-sensitive applications.
The material’s construction features a 0.5 mil PET film on one side and a natural tack on the other.
The natural tack eliminates the need for an additional adhesive layer.
FEATURES AND BENEFITS
|Dielectric Constant, @ 1kHz||6|
|Operating Temperature||-40.0 - 125.0 ℃|
|Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 掳C Shore 00||70|
|Standard Thickness||0.254 - 3.175 mm|
|Thermal Conductivity||2.0 W/mK|
|Volume Resistivity||1x10 Ohm m|