BERGQUIST GAP PAD TGP 2400
BERGQUIST GAP PAD TGP 2400 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K.
The material is a filled-polymer material yielding extremely soft, elastic characteristics.
The material is reinforced to provide easy handling, conversion, added electrical isolation, and tear resistance.
BERGQUIST GAP PAD TGP 2400 is well suited for low-pressure applications that typically use fixed standoff or clip mounting.
BERGQUIST GAP PAD TGP 2400 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even on surfaces with high roughness and/or topography.
BERGQUIST GAP PAD TGP 2400 is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly.
It is also available with a non-tack side.
BERGQUIST GAP PAD TGP 2400 Data Sheet
| Color | Yellow: Light Yellow |
|---|---|
| Density | 3.1 g/cm³ |
| Dielectric Breakdown Voltage | 3000.0 Vac |
| Dielectric Constant, @ 1kHz | 6.6 |
| Flame Rating | V-0 |
| Heat Capacity, ASTM E1269 | 1.0 J/g-K |
| Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 20 |
| Standard Thickness | 0.254 - 6.35 mm |
| Thermal Conductivity | 2.4 W/mK |
| Volume Resistivity | 1x10 Ohm m |
BERGQUIST GAP PAD TGP 2400 Features
- Thermal Conductivity: 2.4 W/m-K
- Low “S-Class” thermal resistance at ultra-low pressures
- Ultra-conformable, “gel-like” modulus
- Designed for low-stress applications
- Fiberglass reinforced for puncture, shear, and tear resistance
BERGQUIST GAP PAD TGP 2400 Applications
- Between processors and heat sinks
- Between graphics chips and heat sinks
- DVD and CDROM electronics cooling
- The area where heat needs to be transferred to a frame,
- chassis or another type of heat spreader
Get in touch
Location
| Sales - Mr Jason |
 |
| Sales - Mrs lulu |
|
| Sales - Mrs Tom |
|
| Sales - Mrs Sasa |
|