BERGQUIST GAP PAD TGP 2700

BERGQUIST GAP PAD TGP 2700 is a thermally conductive, electrically insulating, un-reinforced gap filling material.
The fiberglass reinforcement allows for easy material handling and enhances puncture, shear, and tear resistance.
BERGQUISTGAP PAD TGP 2700 is a filled-polymer material yielding an elastic polymer that allows for easy handling and conversion without the need for reinforcement. These properties also allow for good wet-out and interfacing characteristics to surfaces with roughness and/or topography. All these characteristics make this material ideal for applications using either clip or screw-mounted assemblies.
BERGQUIST GAP PAD TGP 2700 is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly.

FEATURES AND BENEFITS

  • Thermal Conductivity: 2.7 W/m-K
  • High thermal performance, cost-effective solution
  • Un-reinforced construction for additional compliancy
  • Medium compliance and conformability
Data Sheet
Applications

BERGQUIST GAP PAD TGP 2700 Data Sheet

ColorBrown: Light Brown
Operating Temperature-60.0 - 200.0 °C
Standard Thickness0.508 - 3.175 mm
TechnologySilicone
Thermal Conductivity2.7 W/mK

BERGQUIST GAP PAD TGP 2700 Applications

  • Multiple heat-generating components to a common heatsink
  • Graphics chips to heat sinks
  • Processors to heat sinks
  • Mass storage drives
  • Wireline / wireless communications hardware

Get in touch

+86-755-2301-3143

Location

No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
Sales - Mr Jason
Sales - Mrs lulu
Sales - Mrs Tom
Sales - Mrs Sasa

CONTACT FORM HERE

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