BERGQUIST GAP PAD TGP 3000 is a soft gap-filling material rated at a thermal conductivity of 3 W/m-K.
The material offers exceptional thermal performance at low pressures due to an all-new 3 W/m-K filler package and low-modulus resin formulation.
It is reinforced to enhance material handling, puncture, shear, and tear resistance.
It is well suited for high-performance, low-stress applications that typically use fixed standoff or clip mounting.
BERGQUIST GAP PAD TGP 3000 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even on surfaces with high roughness and/or topography.
BERGQUIST GAP PAD TGP 3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The material’s natural inherent tack allows for stick-in-place characteristics during assembly.
BERGQUIST GAP PAD TGP 3000 is supplied with protective liners on both sides.
The top side has reduced tack for ease of handling
