BERGQUIST GAP PAD TGP 3004SF high performance, 3.0W/m-K, thermally conductive gap filling material.
BERGQUIST GAP PAD TGP 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive.
BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no-tack surface on one side and natural tack on the other side.
FEATURES AND BENEFITS
|Carrier Type||0.25 mil PET Film|
|Color||Gray: Light Gray|
|Density, Maximum Final||3.2 g/cm³|
|Operating Temperature||-40.0 - 125.0 ℃|
|Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 掳C Shore 00||70|
|Standard Thickness||0.254 - 3.715 mm|
|Thermal Conductivity||3.0 W/mK|