BERGQUIST GAP PAD TGP 6000ULM

BERGQUIST GAP PAD TGP 6000ULM is a high-performance, silicone-based, ultra-low modulus (ULM) gap pad filler with a thermal conductivity rating of 6.0 W/m-K.
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

FEATURES AND BENEFITS

• Thermal Conductivity: 6.0 W/m-K
• High compliance, low compression stress
• Ultra-low modulus