BERGQUIST GAP PAD TGP 6000ULM

BERGQUIST GAP PAD TGP 6000ULM is a high-performance, silicone-based, ultra-low modulus (ULM) gap pad filler with a thermal conductivity rating of 6.0 W/m-K.
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

FEATURES AND BENEFITS

  • Thermal Conductivity: 6.0 W/m-K
  • High compliance, low compression stress
  • Ultra-low modulus
Data Sheet
Applications

BERGQUIST GAP PAD TGP 6000ULM Data Sheet

Carrier TypeFiberglass
ColorGray
Operating Temperature-60.0 - 200.0 °C
Standard Thickness1.524 - 3.175 mm
TechnologySilicone

BERGQUIST GAP PAD TGP 6000ULM Applications

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal modules to heat sink assembly

Get in touch

+86-755-2301-3143

Location

No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
Sales - Mr Jason
Sales - Mrs lulu
Sales - Mrs Tom
Sales - Mrs Sasa

CONTACT FORM HERE

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