BERGQUIST GAP PAD TGP 7000ULM
BERGQUIST GAP PAD TGP 7000ULM is a thermally conductive, soft gap pad filler designed for high-performance applications.
BERGQUIST® GAP PAD TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra-low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
FEATURES AND BENEFITS
- Thermal Conductivity: 7 W/m-K
- High compliance, low compression stress
- Ultra-low modulus
Data Sheet
Applications
BERGQUIST GAP PAD TGP 7000ULM Data Sheet
| Color | Gray |
|---|---|
| Flame Rating | V-0 |
| Operating Temperature | -60.0 - 200.0 ℃ |
| Standard Thickness | 0.5 - 3.18 mm |
| Technology | Silicone |
BERGQUIST GAP PAD TGP 7000ULM Applications
- Telecommunications (routers, switches, base stations)
- Optical transceivers
- ASICs and DSPs
Get in touch
+86-755-2301-3143
Location
No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
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