BERGQUIST GAP PAD TGP 7000ULM is a thermally conductive, soft gap pad filler designed for high-performance applications.
BERGQUIST® GAP PAD TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra-low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
FEATURES AND BENEFITS
|Operating Temperature||-60.0 - 200.0 ℃|
|Standard Thickness||0.5 - 3.18 mm|