BERGQUIST GAP PAD TGP 800VO

BERGQUIST GAP PAD TGP 800VO is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.
The conformable nature of BERGQUIST GAP PAD TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis

FEATURES AND BENEFITS

Thermal Conductivity: 0.8 W/m-K
Enhanced puncture, shear, and tear resistance
Conformable gap-filling material
Electrically isolating

Data Sheet

Applications

BERGQUIST GAP PAD TGP 800VO Data Sheet

Carrier Type	Sil-Pad
Color	Red: Pink
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 ℃
Standard Thickness	0.508 - 6.35 mm
Technology	Silicone
Thermal Conductivity	0.8 W/mK
Young's Modulus, ASTM D575	689.0 KPa (100.0 psi )

BERGQUIST GAP PAD TGP 800VO Applications

Telecommunications
Computer and peripherals
Power conversion
Between heat-generating semiconductors and a heat sink
The area where heat needs to be transferred to a frame, chassis, or another type of heat spreader
Between heat-generating magnetic components and heat sink