BERGQUIST GAP PAD TGP A2000

BERGQUIST GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to
the adjacent surfaces of components.
The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.

FEATURES AND BENEFITS

Thermal Conductivity: 2.0 W/m-K
Fiberglass reinforced for puncture, shear, and tear resistance
Electrically isolating

Data Sheet

Applications

BERGQUIST GAP PAD TGP A2000 Data Sheet

Carrier Type	Fiberglass
Color	Gray
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 ℃
Standard Thickness	0.254 - 1.016 mm
Technology	Silicone
Thermal Conductivity	0.2 W/mK
Young's Modulus, ASTM D575	379.0 KPa (55.0 psi )

BERGQUIST GAP PAD TGP A2000 Applications

Computer and peripherals
Between CPU and heat spreader
Telecommunications
Heat pipe assemblies
RDRAM memory modules
CDROM / DVD cooling
Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
DDR SDRAM memory modules