BERGQUIST GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.
The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems.
BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
FEATURES AND BENEFITS
|Operating Temperature||-60.0 - 200.0 ℃|
|Standard Thickness||0.254 - 0.508 mm|
|Thermal Conductivity||0.1 W/mK|
|Young's Modulus, ASTM D575||275.0 KPa (40.0 psi )|