BERGQUIST GAP PAD TGP HC1000

BERGQUIST GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.
The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems.
BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.

FEATURES AND BENEFITS

  • Thermal Conductivity: 1.0 W/m-K
  • Highly Conformable, low hardness
  • “Gel-like” modulus
  • Fiberglass reinforced for puncture, shear, and tear resistance
Data Sheet
Applications

BERGQUIST GAP PAD TGP HC1000 Data Sheet

Carrier TypeFiberglass
ColorGray
Flame RatingV-0
Operating Temperature-60.0 - 200.0 ℃
Standard Thickness0.254 - 0.508 mm
TechnologySilicone
Thermal Conductivity0.1 W/mK
Young's Modulus, ASTM D575275.0 KPa (40.0 psi )

BERGQUIST GAP PAD TGP HC1000 Applications

  • Computer and peripherals
  • Telecommunications
  • Heat interfaces to frames, chassis, or other heat-spreading devices
  • RDRAM™ memory modules/chip-scale packages
  • CDROM / DVD cooling
  • Areas where irregular surfaces need to make a thermal interface to a heat sink
  • DDR SDRAM memory modules
  • FBDIMM modules

Get in touch

+86-755-2301-3143

Location

No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
Sales - Mr Jason
Sales - Mrs lulu
Sales - Mrs Tom
Sales - Mrs Sasa

CONTACT FORM HERE

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