BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap-filling material with thermal conductivity of 3.0 W/m-K.
The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even on surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.
The top side has minimal tack for ease of handling.
BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
|Operating Temperature||-60.0 - 200.0 ℃|
|Standard Thickness||0.508 - 3.175 mm|
|Thermal Conductivity||3.0 W/mK|
|Young's Modulus, ASTM D575||110.0 KPa (16.0 psi )|