BERGQUIST SIL PAD TSP 1100ST

BERGQUIST SIL PAD TSP 1100ST is a silicone-based elastomeric material ideal for placement between an electronic power device and a heat sink.

BERGQUIST® SIL PAD TSP 1100ST is a silicone-based, electrically insulating, thermally conductive, soft elastomeric material. This product is fiberglass reinforced which exhibits excellent thermal performance at low mounting pressures. It can be repositioned ensuring higher utilization, ease of use, and assembly error reduction.

Carrier Type： Fiberglass
Color： Yellow
Flame Rating： V-0
Operating Temperature： -60.0 - 180.0 °C
Standard Thickness： 0.305 mm
Technology： Silicone
Thermal Conductivity： 1.1 W/mK
Samples: Free

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1100ST Data Sheet

Technology	Silicone
Appearance	Yellow
Reinforcement Carrier	Fiberglass
Total Thickness	0.305mm
Inherent Surface Tack	2 (2 sides)
Application	Thermal management, Thermally conductive adhesive
Operating Temperature Range	-60 to 180ºC

BERGQUIST SIL PAD TSP 1100ST Features

Inherent tack on both sides for exceptional thermal performance and easy placement
Re-positionable for higher utilization, ease of use, and assembly error reduction
Lined on both sides for ease of handling prior to placement in high-volume assemblies
Exhibits exceptional thermal performance even at a low mounting pressure
Fiberglass reinforced
Value alternative to BERGQUIST SIL PAD TSP 1800ST