BERGQUIST SIL PAD TSP 1600

BERGQUIST SIL PAD TSP 1600 is a thermally conductive, silicone-based, and highly compliant soft pad material that features minimal thermal resistance and maximum thermal performance.
BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass-reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures.

  • Carrier Film Thickness: 0.025 mm
  • Dielectric Breakdown Voltage: 3000.0 Vac
  • Dielectric Constant, @ 1kHz: 6.0
  • Flame Rating: V-0
  • Operating Temperature: -60.0 - 180.0 °C
  • Phase Change Temperature: 55.0 °C
  • Shore Hardness, ASTM D2240 Shore A:91.0
  • Standard Thickness:0.127 mm
  • Thermal Conductivity: 1.6 W/mK
  • Thermal Impedance, ASTM D5470 @ 50 psi: 0.45 °C-in²/W
  • Volume Resistivity: 1×10 Ohm m
Data Sheet
Features
Applications

BERGQUIST SIL PAD TSP 1600 Data Sheet

TechnologySilicone
AppearanceGold
Reinforcement CarrierFiberglass
Total Thickness , ASTM
D374
0.127 mm
ApplicationThermal management,
Thermally conductive adhesive
Physical Properties
Operating Temperature
Range
-60 to 180ºC
Hardness, Shore A, ASTM D224091
Elongation , 45º to warp and fill, ASTM D412,%20
Tensile Strength, ASTM D412, MPa12
Flammability Rating, UL 94V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac3,000
Dielectric Constant, ASTM D150 @ 1,000 Hz6
Volume Resistivity, ASTM D257, ohm-meter1×10¹º
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)1.6
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi3.56
@ 25 psi3.01
@ 50 psi2.45
@ 100 psi2.05
@ 200 psi1.74
Thermal Impedance, ASTM D5470, ºC-in2
/W (1)
@ 10 psi0.92
@ 25 psi0.6
@ 50 psi0.45
@ 100 psi0.36
@ 200 psi0.29

BERGQUIST SIL PAD TSP 1600 Features

  • Thermal impedance: 0.45ºC-in2/W @ 50 psi
  • High-value material
  • Smooth and highly compliant surface
  • Electrically isolating

BERGQUIST SIL PAD TSP 1600 Applications

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

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Location

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