BERGQUIST SIL PAD TSP 1600S

BERGQUIST SIL PAD TSP 1600S is a high-performance, silicone-based, thermally conductive, and electrically insulating general-purpose thermal interface solution for low-pressure applications.
BERGQUIST® SIL PAD TSP 1600S is a silicone-based, thermally conductive, and electrically insulating general-purpose thermal interface solution. This product is fiberglass reinforced with a smooth and highly compliant surface with high thermal conductivity. These features of the product minimize thermal resistance and maximize thermal performance.

Low mounting pressures
Thermal impedance: 0.61ºC-in2/W (@50 psi)
Smooth and highly compliant surface
Electrically isolating
Technology: Silicone
Appearance: Pink
Reinforcement Carrier: Fiberglass
Total Thickness, ASTM D374:0.229mm
Application: Thermal management, Thermally conductive adhesive Operating Temperature
Range:-60 to 180ºC

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1600S Data Sheet

Technology	Silicone
Appearance	Pink
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.229mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D2240	92
Elongation , 45º to warp and fill, ASTM D412,%	20
Tensile Strength, ASTM D412, MPa	9
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	5,500
Dielectric Constant, ASTM D150 @ 1,000 Hz	6
Volume Resistivity, ASTM D257, ohm-meter	1×10¹º
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.6
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	3.96
@ 25 psi	3.41
@ 50 psi	2.9
@ 100 psi	2.53
@ 200 psi	2.32
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	0.95
@ 25 psi	0.75
@ 50 psi	0.61
@ 100 psi	0.47
@ 200 psi	0.41