BERGQUIST SIL PAD TSP 1600S

BERGQUIST SIL PAD TSP 1600S is a high-performance, silicone-based, thermally conductive, and electrically insulating general-purpose thermal interface solution for low-pressure applications.
BERGQUIST® SIL PAD TSP 1600S is a silicone-based, thermally conductive, and electrically insulating general-purpose thermal interface solution. This product is fiberglass reinforced with a smooth and highly compliant surface with high thermal conductivity. These features of the product minimize thermal resistance and maximize thermal performance.

  • Low mounting pressures
  • Thermal impedance: 0.61ºC-in2/W (@50 psi)
  • Smooth and highly compliant surface
  • Electrically isolating
  • Technology: Silicone
  • Appearance: Pink
  • Reinforcement Carrier: Fiberglass
  • Total Thickness, ASTM D374:0.229mm
  • Application: Thermal management, Thermally conductive adhesive Operating Temperature
  • Range:-60 to 180ºC
Data Sheet
Features
Applications

BERGQUIST SIL PAD TSP 1600S Data Sheet

TechnologySilicone
AppearancePink
Reinforcement CarrierFiberglass
Total Thickness , ASTM
D374
0.229mm
ApplicationThermal management,
Thermally conductive adhesive
Physical Properties
Operating Temperature
Range
-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D224092
Elongation , 45º to warp and fill, ASTM D412,%20
Tensile Strength, ASTM D412, MPa9
Flammability Rating, UL 94V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac5,500
Dielectric Constant, ASTM D150 @ 1,000 Hz6
Volume Resistivity, ASTM D257, ohm-meter1×10¹º
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)1.6
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi3.96
@ 25 psi3.41
@ 50 psi2.9
@ 100 psi2.53
@ 200 psi2.32
Thermal Impedance, ASTM D5470, ºC-in2
/W (1)
@ 10 psi0.95
@ 25 psi0.75
@ 50 psi0.61
@ 100 psi0.47
@ 200 psi0.41

BERGQUIST SIL PAD TSP 1600S Features

  • Thermal impedance: 0.61ºC-in2/W @ 50 psi
  • Electrically isolating
  • Low mounting pressures
  • Smooth and highly compliant surface
  • General-purpose thermal interface material solution

BERGQUIST SIL PAD TSP 1600S Applications

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

Get in touch

+86-755-2301-3143

Location

No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
Sales - Mr Jason
Sales - Mrs lulu
Sales - Mrs Tom
Sales - Mrs Sasa

CONTACT FORM HERE

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