BERGQUIST SIL PAD TSP 1800

BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone-based, Fiberglass-reinforced, Thermally Conductive Elastomeric Material
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating.
BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw and clip-mounted applications.

Thermal impedance: 0.53°C-in2/W (@50 psi)
Exceptional thermal performance at lower application pressures
Superior breakdown voltage and surface "wet out" values
Smooth and non-tacky on both sides for easy re-positioning, ease of use, and assembly error reduction
Conductive Elastomeric Material
Carrier Type: Fiberglass
Color: Black
Flame Rating: V-0
Standard Thickness:0.229 - 0.406 mm
Technology: Silicone
Thermal Conductivity:1.8 W/mK

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1800 Data Sheet

Technology	Silicone
Appearance	Black
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.229 to 0.406mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Shore Hardness, ASTM D2240, Shore 00	80
Elongation , 45º to warp and fill, ASTM D412,%	20
Tensile Strength, ASTM D412, MPa	9
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	6,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	8
Volume Resistivity, ASTM D257, ohm-meter	1×10⁹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.8
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	2.82
@ 25 psi	2.64
@ 50 psi	2.41
@ 100 psi	2.13
@ 200 psi	1.9
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	0.71
@ 25 psi	0.62
@ 50 psi	0.53
@ 100 psi	0.47
@ 200 psi	0.41

BERGQUIST SIL PAD TSP 1800 Features

Thermal impedance: 0.53ºC-in2/W @ 50 psi
Exceptional thermal performance at lower application pressures
Smooth and non-tacky on both sides for easy re-positioning, ease of use, and assembly error reduction
Superior breakdown voltage and surface “wet out” values
Designed for applications where electrical isolation is critical
Excellent cut-through resistance, designed for screw and clip-mounted applications