BERGQUIST SIL PAD TSP 3500 is a white, high-performance, silicone pad material that is designed for demanding aerospace and commercial applications.
BERGQUIST® SIL PAD TSP 3500 is a thermally conductive insulating material that is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix.
The conformable material is grease-free and reinforced with fiberglass providing high reliability for electronic packaging applications.
Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
|Total Thickness , ASTM|
|0.254 to 0.508mm|
Thermally conductive adhesive
|-60 to 200ºC|
|Shore Hardness, ASTM D2240, Shore 00||90|
|Flammability Rating, UL 94||V-0|
|Dielectric Breakdown Voltage , ASTM D149, Vac||4,000|
|Dielectric Constant, ASTM D150 @ 1,000 Hz||4|
|Volume Resistivity, ASTM D257, ohm-meter||1×10¹¹|
|Thermal Conductivity , ASTM D5470, W/(m-K)||3.5|
|Thermal Performance vs. Pressure|
|TO-220 Thermal Performance, ºC/W|
|@ 10 psi||2.61|
|@ 25 psi||2.32|
|@ 50 psi||2.02|
|@ 100 psi||1.65|
|@ 200 psi||1.37|
|Thermal Impedance, ASTM D5470, ºC-in2
|@ 10 psi||0.57|
|@ 25 psi||0.43|
|@ 50 psi||0.33|
|@ 100 psi||0.25|
|@ 200 psi||0.2|