BERGQUIST SIL PAD TSP 3500

BERGQUIST SIL PAD TSP 3500 is a white, high-performance, silicone pad material that is designed for demanding aerospace and commercial applications.
BERGQUIST® SIL PAD TSP 3500 is a thermally conductive insulating material that is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix.
The conformable material is grease-free and reinforced with fiberglass providing high reliability for electronic packaging applications.
Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.

Thermal impedance 0.33°C-in2/W (@50 psi)
High thermal conductivity 3.5 W/m-K
Optimal heat transfer
Carrier Type： Fiberglass
Color： White
Flame Rating： V-0
Operating Temperature：-60.0 - 200.0 °C
Standard Thickness：0.254 - 0.508 mm
Technology： Silicone
Thermal Conductivity：3.5 W/mK

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 3500 Data Sheet

Technology	Silicone
Appearance	White
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.254 to 0.508mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 200ºC
Physical Properties
Shore Hardness, ASTM D2240, Shore 00	90
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	4,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	4
Volume Resistivity, ASTM D257, ohm-meter	1×10¹¹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	3.5
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	2.61
@ 25 psi	2.32
@ 50 psi	2.02
@ 100 psi	1.65
@ 200 psi	1.37
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	0.57
@ 25 psi	0.43
@ 50 psi	0.33
@ 100 psi	0.25
@ 200 psi	0.2