BERGQUIST SIL PAD TSP A2000, Electrically Insulating, Silicone-based, Thermally Conductive Elastomeric Material
BERGQUIST® SIL PAD® TSP A2000 is a silicone-based thermally conductive and electrically insulating material.
It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. BERGQUIST SIL PAD TSP A2000 performs well under clamping pressure up to 200 psi and is an excellent choice for high-performance applications requiring electrical isolation and cut-through resistance.
Options and Configurations Configuration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive on one side, no adhesive standard thickness - 0.010"Custom-made configurations available upon request
Technology | Silicone |
Appearance | Green |
Reinforcement Carrier | Fiberglass |
Total Thickness , ASTM D374 | 0.254mm |
Application | Thermal management, Thermally conductive adhesive |
Physical Properties | |
Operating Temperature Range | -60 to 180ºC |
Physical Properties | |
Hardness, Shore A, ASTM D2240 | 80 |
Breaking Strength, ASTM D1458, KN/m | 12 |
Elongation , 45º to warp and fill, ASTM D412,% | 40 |
Flammability Rating, UL 94 | V-0 |
Electrical Properties | |
Dielectric Breakdown Voltage , ASTM D149, Vac | 6,000 |
Dielectric Constant, ASTM D150 @ 1,000 Hz | 7 |
Volume Resistivity, ASTM D257, ohm-meter | 1×10¹¹ |
Thermal Properties | |
Thermal Conductivity , ASTM D5470, W/(m-K) | 2 |
Thermal Performance vs. Pressure | |
TO-220 Thermal Performance, ºC/W | |
@ 10 psi | 3.03 |
@ 25 psi | 2.62 |
@ 50 psi | 2.21 |
@ 100 psi | 1.92 |
@ 200 psi | 1.78 |
Thermal Impedance, ASTM D5470, ºC-in2 /W (1) |
|
@ 10 psi | 0.59 |
@ 25 psi | 0.5 |
@ 50 psi | 0.42 |
@ 100 psi | 0.34 |
@ 200 psi | 0.31 |