BERGQUIST SIL PAD TSP A2000

BERGQUIST SIL PAD TSP A2000, Electrically Insulating, Silicone-based, Thermally Conductive Elastomeric Material
BERGQUIST® SIL PAD® TSP A2000 is a silicone-based thermally conductive and electrically insulating material.
It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. BERGQUIST SIL PAD TSP A2000 performs well under clamping pressure up to 200 psi and is an excellent choice for high-performance applications requiring electrical isolation and cut-through resistance.
Options and Configurations Configuration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive on one side, no adhesive standard thickness - 0.010"Custom-made configurations available upon request

  • Carrier Film Thickness:0.051 mm
  • Dielectric Breakdown Voltage:6000.0 Vac
  • Dielectric Constant, @ 1kHz :7.0
  • Flame Rating: V-0
  • Operating Temperature :-60.0 - 180.0 °C
  • Phase Change Temperature:60.0 °C
  • Shore Hardness, ASTM D2240 Shore A:80.0
  • Standard Thickness:0.254 mm
  • Thermal Conductivity :2.0 W/mK
  • Thermal Impedance, ASTM D5470 @ 50 psi :0.42 °C-in²/W
  • Volume Resistivity:1×10 Ohm m
Data Sheet
Features
Applications

BERGQUIST SIL PAD TSP A2000 Data Sheet

TechnologySilicone
AppearanceGreen
Reinforcement CarrierFiberglass
Total Thickness , ASTM
D374
0.254mm
ApplicationThermal management,
Thermally conductive adhesive
Physical Properties
Operating Temperature
Range
-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D224080
Breaking Strength, ASTM D1458, KN/m12
Elongation , 45º to warp and fill, ASTM D412,%40
Flammability Rating, UL 94V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac6,000
Dielectric Constant, ASTM D150 @ 1,000 Hz7
Volume Resistivity, ASTM D257, ohm-meter1×10¹¹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)2
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi3.03
@ 25 psi2.62
@ 50 psi2.21
@ 100 psi1.92
@ 200 psi1.78
Thermal Impedance, ASTM D5470, ºC-in2
/W (1)
@ 10 psi0.59
@ 25 psi0.5
@ 50 psi0.42
@ 100 psi0.34
@ 200 psi0.31

BERGQUIST SIL PAD TSP A2000 Features

  • Thermal impedance: 0.42ºC-in2/W @ 50 psi
  • Elastomeric compound coated on both sides
  • Less sensitive to clamping pressure because of its smooth surface finish

BERGQUIST SIL PAD TSP A2000 Applications

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

Get in touch

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Location

No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
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Sales - Mrs Tom
Sales - Mrs Sasa

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