BERGQUIST SIL PAD TSP K1100 is a medium-performance Kapton-based thermally conductive insulator.
Thermally conductive Kapton MT film is coated with an aluminum oxide/boron nitride-filled silicone elastomer to deliver"boron nitride" performance. Kapton film provides a continuous physically tough dielectric barrier against "cut-through" and resultant assembly failures.
BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator
BERGQUIST® SIL PAD® TSP K1100 is a medium-performance, film-based thermally conductive insulator.
The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against “cut-through” and resultant assembly failures. Options and ConfigurationsConfiguration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive on one side, no adhesive standard thickness - 0.006"Custom-made configurations available upon request
|Total Thickness , ASTM|
|0.15 ± 0.025
Thermally conductive adhesive
|-60 to 180ºC|
|Hardness, Shore A, ASTM D2240||90|
|Breaking Strength, ASTM D1458, KN/m||5|
|Elongation , 45º to warp and fill, ASTM D412,%||40|
|Tensile Strength, ASTM D412, MPa||35|
|Dielectric Breakdown Voltage , ASTM D149, Vac||6,000|
|Dielectric Constant, ASTM D150 @ 1,000 Hz||4|
|Volume Resistivity, ASTM D257, ohm-meter||1×10¹²|
|Thermal Conductivity , ASTM D5470, W/(m-K)||1.1|
|Thermal Resistance Bergquist Flat Plate Test|