BERGQUIST SIL PAD TSP K1300

BERGQUIST SIL PAD TSP K1300 is a high-performance insulator developed in conjunction with DuPont. BERGQUIST SIL PAD TSP K1300 combines special Kapton MT Polyimide film with boron nitride-filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance.
BERGQUIST SIL PAD TSP K1300 is designed to replace ceramic insulators such as Beryllium Oxide, boron Nitride, and Alumina. These insulators are expensive and they break easily.
BERGQUIST SIL PAD TSP K1300 eliminates breakage and costs much less than ceramics.
BERGQUIST SIL PAD TSP K1300 is a beige, silicone-based thermal interface gap pad material with a Kapton film with good cut-through properties.
BERGQUIST® SIL PAD TSP K1300 is a high-performance material that was developed in conjunction with DuPont. By combining a special Kapton MT Polyimide film with boron nitride-filled silicone rubber, this product exhibits high performance and good cut-through characteristics. BERGQUIST SIL PAD TSP K1300 is a cost-effective and durable material that can be used as a replacement for fragile and expensive ceramic insulators.

Tough dielectric barrier against cut-through
High-performance film
Thermal impedance: 0.41°C -in2/W (@50 psi)
Replaces ceramic insulators
Carrier Type: Kapton
Color :Brown: Beige
Operating Temperature:-60.0 - 180.0 °C
Technology: Silicone

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP K1300 Data Sheet

Technology	Silicone
Appearance	Beige
Reinforcement Carrier	Kapton
Total Thickness , ASTM D374	0.15 ± 0.025 mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D2240	90
Breaking Strength, ASTM D1458, KN/m	5
Elongation , 45º to warp and fill, ASTM D412,%	40
Tensile Strength, ASTM D412, MPa	35
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	6,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	3.7
Volume Resistivity, ASTM D257, ohm-meter	1×10¹²
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.3
Thermal Resistance Bergquist Flat Plate Test Method, ºC-in2 /W	0.2
Thermal Vacuum Weight Loss (TML), as manufactured, NASA SP-R-0022A, %	0.36
Volatile Condensable Material (VCM), as manufactured, NASA SP-R-0022A, %	0.09