BERGQUIST SIL PAD TSP K900

BERGQUIST SIL PAD TSP K900 is designed and developed in conjunction with DuPont. BERGQUIST SIL PAD TSP K900 combines the thermal transfer properties of well-known Sil-Pad rubber with high dielectric strength, a physically tough DuPont Kapton MT file.
Kapton MT is a specially developed film that has high thermal conductivity. The result is a durable insulator that withstands high voltages, requires no thermal grease to transfer heat, is available in customized shapes and sizes, and saves time and costs while increasing productivity.
BERGQUIST SIL PAD TSP K900 is a high-performance silicone Kapton insulator.
BERGQUIST® SIL PAD TSP K900 is a silicone-Kapton-reinforced insulator. This product combines the thermal transfer properties of Sil-pad with high dielectric strength and physically tough Kapton. It is a highly durable product that withstands high voltages.

Thermal impedance: 0.48°C-in2/W (@50 psi)
Withstands high voltages
High dielectric strength
Very durable

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP K900 Data Sheet

Technology	Silicone
Appearance	Gray
Reinforcement Carrier	Kapton
Total Thickness , ASTM D374	0.15 ± 0.025 mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D2240	90
Breaking Strength, ASTM D1458, KN/m	5
Elongation , 45º to warp and fill, ASTM D412,%	40
Tensile Strength, ASTM D412, MPa	35
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	6,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	5
Volume Resistivity, ASTM D257, ohm-meter	1×10¹²
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	0.9
Thermal Resistance Bergquist Flat Plate Test Method, ºC-in2 /W	0.4
Thermal Vacuum Weight Loss (TML), as manufactured, NASA SP-R-0022A, %	0.28
Volatile Condensable Material (VCM), as manufactured, NASA SP-R-0022A, %	0.07