BERGQUIST SIL PAD TSP PP1200 is a fiberglass-reinforced insulator coated with a filled polyester resin. The material offers superior thermal resistance for high-performance applications.
Polyester-based, thermally conductive insulators from BERGQUIST provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (Telecomm and certain aerospace applications).
Poly-Pads are constructed with ceramic-filled polyester resin coating on either side of a fiberglass carrier or a film carrier.
The Poly-Pad family offers a complete range of performance characteristics to match individual applications.
BERGQUIST SIL PAD TSP PP1200, Polyester-Based, Thermally Conductive Insulation Material
BERGQUIST® SIL PAD® TSP PP1200 is a fiberglass-based insulator coated with a filled polyester resin. The material offers superior thermal resistance for high-performance applications. SIL PADS are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecom & certain aerospace applications). SIL PADS are constructed with ceramic-filled polyester resin coating on either side of a fiberglass carrier or a film carrier. The SIL PAD family offers a complete range of performance characteristics to match individual applications. Options and ConfigurationsStandard thickness - 0.009"Custom-made configurations available upon request
Technology | Silicone |
Appearance | White |
Reinforcement Carrier | Fiberglass |
Total Thickness , ASTM D374 | 0.254 to 0.508mm |
Application | Thermal management, Thermally conductive adhesive |
Physical Properties | |
Operating Temperature Range | -60 to 200ºC |
Physical Properties | |
Shore Hardness, ASTM D2240, Shore 00 | 90 |
Flammability Rating, UL 94 | V-0 |
Electrical Properties | |
Dielectric Breakdown Voltage , ASTM D149, Vac | 4,000 |
Dielectric Constant, ASTM D150 @ 1,000 Hz | 4 |
Volume Resistivity, ASTM D257, ohm-meter | 1×10¹¹ |
Thermal Properties | |
Thermal Conductivity , ASTM D5470, W/(m-K) | 3.5 |
Thermal Performance vs. Pressure | |
TO-220 Thermal Performance, ºC/W | |
@ 10 psi | 2.61 |
@ 25 psi | 2.32 |
@ 50 psi | 2.02 |
@ 100 psi | 1.65 |
@ 200 psi | 1.37 |
Thermal Impedance, ASTM D5470, ºC-in2 /W (1) |
|
@ 10 psi | 0.57 |
@ 25 psi | 0.43 |
@ 50 psi | 0.33 |
@ 100 psi | 0.25 |
@ 200 psi | 0.2 |