BERGQUIST SIL PAD TSP Q2000
BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal greases such as contamination of electronic assemblies and reflow solder baths.
BERGQUISTSIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry.
BERGQUIST SIL PAD TSP Q2000, Fiberglass-Reinforced, Silicone-based, Grease Replacement Thermal Interface
BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal greases such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
- Carrier Type ： Fiberglass
- Color ： Black
- Flame Rating：V-0
- Operating Temperature：-60.0 - 180.0 °C
- Technology ： Silicone
- Thermal Conductivity：0.2 W/mK
BERGQUIST SIL PAD TSP Q2000 Data Sheet
| Technology | Silicone |
| Appearance | Black |
| Reinforcement Carrier | Fiberglass |
| Total Thickness , ASTM D374 | 0.127mm |
| Application | Thermal management, Thermally conductive adhesive |
| Operating Temperature Range | -60 to 180ºC |
| Physical Properties | |
| Hardness, Shore A, ASTM D2240 | 86 |
| Flammability Rating, UL 94 | V-0 |
| Electrical Properties | |
| Dielectric Breakdown Voltage , ASTM D149, Vac | Non-Ins ulating |
| Dielectric Constant, ASTM D150 @ 1,000 Hz | NA |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10² |
| Thermal Properties | |
| Thermal Conductivity , ASTM D5470, W/(m-K) | 2 |
| Thermal Performance vs. Pressure | |
| TO-220 Thermal Performance, ºC/W | |
| @ 10 psi | 2.26 |
| @ 25 psi | 1.99 |
| @ 50 psi | 1.76 |
| @ 100 psi | 1.53 |
| @ 200 psi | 1.3 |
| Thermal Impedance, ASTM D5470, ºC-in2 /W (1) | |
| @ 10 psi | 0.65 |
| @ 25 psi | 0.48 |
| @ 50 psi | 0.35 |
| @ 100 psi | 0.24 |
| @ 200 psi | 0.16 |
BERGQUIST SIL PAD TSP Q2000 Features
- Thermal impedance: 0.35ºC-in2/W @ 50 psi
- Eliminates processing constraints typically associated with grease
- Conforms to surface textures
- Easy handling
- It May be installed prior to soldering and cleaning without worry
BERGQUIST SIL PAD TSP Q2000 Applications
- Between a transistor and a heat sink
- Between two large surfaces such as an L-bracket and the chassis of an assembly
- Between a heat sink and a chassis
- Under electrically isolated power modules or devices such as resistors, transformers, and solid-state relays
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