BERGQUIST SIL PAD TSP Q2500
BERGQUIST SIL PAD TSP Q2500, Aluminum-foil substrate, Silicone-based Grease Replacement for Maximum Heat Transfer
BERGQUIST® SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. BERGQUIST SIL PAD TSP Q2500 is the ideal thermal interface material to replace messy thermal grease compounds. BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with greases such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust collection which can cause possible surface shorting or heat buildup.
- Color :Red: Pink
- Operating Temperature:-60.0 - 180.0 °C
- Technology: Silicone
- Thermal Conductivity:1.2 W/mK
BERGQUIST SIL PAD TSP Q2500 Data Sheet
| Technology | Silicone |
| Appearance | Black |
| Reinforcement Carrier | Aluminum |
| Total Thickness , ASTM D374 | 0.152mm |
| Application | Thermal management, Thermally conductive adhesive |
| Operating Temperature Range | -60 to 180ºC |
| Physical Properties | |
| Hardness, Shore A, ASTM D2240 | 93 |
| Flammability Rating, UL 94 | V-0 |
| Electrical Properties | |
| Dielectric Breakdown Voltage , ASTM D149, Vac | Non-Ins ulating |
| Dielectric Constant, ASTM D150 @ 1,000 Hz | NA |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10² |
| Thermal Properties | |
| Thermal Conductivity , ASTM D5470, W/(m-K) | 2.5 |
| Thermal Performance vs. Pressure | |
| TO-220 Thermal Performance, ºC/W | |
| @ 10 psi | 2.44 |
| @ 25 psi | 1.73 |
| @ 50 psi | 1.23 |
| @ 100 psi | 1.05 |
| @ 200 psi | 0.92 |
| Thermal Impedance, ASTM D5470, ºC-in2 /W (1) | |
| @ 10 psi | 0.52 |
| @ 25 psi | 0.3 |
| @ 50 psi | 0.22 |
| @ 100 psi | 0.15 |
| @ 200 psi | 0.12 |
BERGQUIST SIL PAD TSP Q2500 Features
- Thermal impedance: 0.22ºC-in2 /W @ 50 psi
- Maximum heat transfer
- Aluminum foil coated both sides
- Designed to replace thermal grease
BERGQUIST SIL PAD TSP Q2500 Applications
- Between a transistor and a heat sink
- Between two large surfaces such as an L-bracket and the chassis of an assembly
- Between a heat sink and a chassis
- Under electrically isolated power modules or devices such as resistors, transformers, and solid-state relays
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