Saint Gobain ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips.
|Thickness, nominal: in.||.015, .025, .032, .050, .062|
|Thermal Conductivity: W/mK||1.3|
|Thermal Impedance: °C in.2 /W (1/16")||1.25|
|Break Strength: psi||200|
|Hardness: Shore A||65|
|Dielectric Strength: volts/mil||250|
|Operating Temperature: °F||-80 to 400|