The thermal conductive silica gel sheet

Thermal tape for gpu is a kind of double-sided tape with thermal insulation function.

Thermal insulation tape is filled by high-performance acrylic pressure-sensitive adhesive with high thermal conductive ceramic particle coating made of glass fiber cloth on both sides or without the substrate.

Heatsink Thermal Tape is made of advanced heat-conductive pressure-sensitive adhesive to meet the requirements of high adhesion strength and excellent thermal efficiency.

Thermal Tape For Motherboard is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices.

Thermal conductive tape is made of advanced heat-conductive pressure-sensitive adhesive to meet the requirements of high adhesion strength and excellent thermal efficiency.

BERGQUIST SIL PAD TSP PP1200 is a fiberglass-reinforced insulator coated with a filled polyester resin. The material offers superior thermal resistance for high-performance applications.

BERGQUIST SIL PAD TSP Q2500, Aluminum-foil substrate, Silicone based Grease Replacement for Maximum Heat Transfer.

BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal greases such as contamination of electronic assemblies and reflow solder baths.

BERGQUIST SIL PAD TSP PPK1300 is a composite of film coated with a polyester resin.

BERGQUIST SIL PAD TSP PPK900, Polyester-Based, Thermally Conductive Insulation Material.

BERGQUIST SIL PAD TSP PP900 is a fiberglass-reinforced insulator coated with a filled polyester resin.

BERGQUIST SIL PAD TSP K1100 is a medium-performance Kapton-based thermally conductive insulator.

BERGQUIST SIL PAD TSP K900 is designed and developed in conjunction with DuPont. BERGQUIST SIL PAD TSP K900 combines the thermal transfer properties of well-known Sil-Pad rubber with high dielectric strength, physically tough DuPont Kapton MT file.

BERGQUIST SIL PAD TSP A3000 is a conformable elastomer with a very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks.

BERGQUIST SIL PAD TSP A2000, Electrically Insulating, Silicone-based, Thermally Conductive Elastomeric Material

BERGQUIST SIL PAD TSP 3500 is a white, high-performance, silicone pad material that is designed for demanding aerospace and commercial applications.

BERGQUIST SIL PAD TSP 1800ST is a thermally conductive, fiberglass reinforced, and soft pad material with natural tack on both sides.

BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone-based, Fiberglass-reinforced, Thermally Conductive Elastomeric Material

BERGQUIST SIL PAD TSP 1680 is a mauve-colored, silicone pad material that is designed for high crushing and cut-through resistance typically found in high-pressure applications.

BERGQUIST SIL PAD TSP 1600S is a high-performance, silicone-based, thermally conductive, and electrically insulating general-purpose thermal interface solution for low-pressure applications.

BERGQUIST SIL PAD TSP 900 is a silicone-based, thermally conductive insulator with excellent mechanical and physical characteristics.

BERGQUIST SIL PAD TSP 1600 is a thermally conductive, silicone-based, and highly compliant soft pad material that features minimal thermal resistance and maximum thermal performance.

BERGQUIST SIL PAD TSP 1500, Electrically Insulating, Thermally Conductive Elastomeric Material.

BERGQUIST SIL PAD TSP 1416, a highly thermally conductive, electrically insulating silicone elastomeric material.

BERGQUIST SIL PAD TSP 1100ST is a silicone-based elastomeric material ideal for placement between an electronic power device and heat sink.