The lower assembly pressure can achieve a compression ratio of 15%-30%
Product name: Thermal conductive silicone pad
Product color: blue
Product thickness:0.3-1.2mm
Product specification:200*400mm
Thermal conductivity :2.0W/ M.K.
Features
Applications
Thermal conductive silicone pads Features
Withstand voltage greater than 4KV
Heat resistance: - 40 ~ + 200
Hardness is adjustable, toughness is adjustable, and surface viscosity is adjustable.
Low compressive stress
The lower assembly pressure can achieve a compression ratio of 15% to 30%, which can maximize the filling of structural parts and reduce thermal resistance.
Thermal conductive silicone pads Applications
Heat conduction and heat dissipation of electronic equipment