What is thermal conductive material

The thermally conductive material's main type

• Graphene
• Heat-conductive adhesive graphene preparation equipment
• Heat conductive tester heating element
• Heat conductive silica gel sheet
• Heat-conductive insulating material
• Heat-conductive interface material
• Heat-conductive silicone tape
• Heat-conductive silicone grease
• Heat conductive paste
• Heat dissipation paste
• Heat dissipation silicone grease
• Heat dissipation oil
• Heat dissipation film
• Heat conduction film

 As a special subject, thermal design successfully solves the problem of heat loss or retention in equipment. In thermal design, it is often necessary to consider the heat conduction between power devices and radiators. Reasonable selection of heat transfer medium should not only consider its heat transfer capacity but also take into account the process, maintenance operability, and excellent cost performance in production.

These materials are designed for the heat conduction requirements of equipment in recent years, with excellent and reliable performance. They are suitable for various environments and requirements, have appropriate countermeasures for possible heat conduction problems, provide powerful help for the high integration of equipment, and are ultra-small and ultra-thin. Heat-conduction products have been more and more applied to many products to improve their reliability of products.

• Phase change thermal insulation material. Using the characteristics of the substrate, a phase change occurs at the working temperature, so that the material is more close to the contact surface. At the same time, it also obtains ultra-low thermal resistance and more thorough heat transfer. It is a reliable choice for important devices such as CPU and module power supply.
• Thermal conductive pad. The crystallization of special processes and advanced technology, extraordinary thermal conductivity, and low resistance are the materials used on special occasions. Its thermal conductivity and the flexibility of the material itself well meet the heat dissipation and installation requirements of power devices.
• Heat conduction tape. Widely used in the bonding between power devices and radiators, it can realize the functions of heat conduction, insulation, and fixation at the same time, and can effectively reduce the volume of equipment. It is a favorable choice to reduce the cost of equipment.
•  Thermal insulation elastic rubber. With good thermal conductivity and high-grade pressure resistance, it meets the needs of the electronic industry for thermally conductive materials. It is a binary dispersion instead of silicone grease thermal conductive paste and mica sheet The best product of the thermal system. This kind of product is easy to install and is conducive to automatic production and product maintenance. It is a new material with great manufacturability and practicability.
•  Flexible heat conduction pad. The utility model relates to a thick heat conduction pad, which is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap and complete the heat transfer between the heating part and the heat dissipation part. At the same time, it can also play the role of shock absorption, insulation, and sealing, and can meet the design requirements of miniaturization and ultra-thin equipment.
• Thermal conductive filler. It can also be used as a heat conductive adhesive, which not only has the effect of heat conduction, but is also a good material for bonding, sealing, and potting. Through the filling of the butt contact surface or can body, Conduct heat of heating parts.
• Thermal insulation potting adhesive. Thermal insulation potting adhesive is suitable for potting electronic components with high heat dissipation requirements. After curing, the adhesive has good thermal conductivity, excellent insulation, excellent electrical properties, Good adhesion, and surface gloss.

Thermal insulation elastic rubber

The thermal insulation elastic rubber adopts silicone rubber substrate and ceramic particles such as boron nitride and alumina as fillers, which have very good thermal conductivity. Under the same conditions, the thermal impedance is less than that of other heat-conducting materials. It has the characteristics of soft, clean, pollution-free, radioactive, and high insulation. Glass fiber reinforcement provides good mechanical properties, anti-puncture, shear, and tear resistance, and can be equipped with thermal conductive pressure-sensitive adhesive. The thermal conductivity of the thermal conductive rubber is not only related to the thickness of the thermally conductive material but also related to the service area of the thermally conductive material. Due to the structural relationship of heat-conducting materials, generally, heat-conducting materials will also be related to pressure. If the pressure is high, the thermal conductivity will be strong. Generally, the pressure of heat-conducting materials is 5-100psi, and the installation pressure of most radiators will not exceed 250psi.

Alumina thermal conductive rubber: with good thermal conductivity and beautiful appearance, it is widely used for heat dissipation of communication and other products.

Boron nitride thermal conductive rubber: excellent thermal conductivity, suitable for heat dissipation of high-power devices. Under the same conditions, compared with ordinary thermal conductive materials, the device temperature can be reduced by more than 20 ℃.

Precautions for use:

The above thermal insulation materials are based on silicone rubber. When in use, the heat dissipation surface shall be smooth and clean without burrs, so as not to puncture the rubber sheet and damage the insulation. The smaller the thermal resistance of the heat-conducting material, the shorter the stabilization time and the lower the stabilization temperature. The use of heat-conductive insulating sheets does not need to be supplemented by other materials.

Phase change thermal insulation material

Phase change thermal insulation material is mainly used for high-performance microprocessors and heating elements requiring very low thermal resistance to ensure good heat dissipation. Phase change thermal conductive insulating materials will undergo phase change at about 45 ~ 50 ℃. Under the action of pressure, it flows into and fills the irregular gap between the heating body and the radiator to squeeze out the air to form a good thermally conductive interface.

Application:

Microprocessor, memory module, and cache memory chip

DC / DC converter, IGBT, and other power modules

Power semiconductor device, solid-state relay, bridge rectifier

The phase change liner is packaged in rolls, with a length of 100 feet and a standard width of 25.4 mm. A variety of specifications are available.