BERGQUIST SIL PAD TSP K1100

BERGQUIST SIL PAD TSP K1100 is a medium-performance Kapton-based thermally conductive insulator.
Thermally conductive Kapton MT film is coated with an aluminum oxide/boron nitride-filled silicone elastomer to deliver"boron nitride" performance. Kapton film provides a continuous physically tough dielectric barrier against "cut-through" and resultant assembly failures.
BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator
BERGQUIST® SIL PAD® TSP K1100 is a medium-performance, film-based thermally conductive insulator.
The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against “cut-through” and resultant assembly failures. Options and ConfigurationsConfiguration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive on one side, no adhesive standard thickness - 0.006"Custom-made configurations available upon request

Thermal impedance 0.49°C-in2/W (@50 psi)
Medium performance film
Less sensitive to clamping pressure because of its smooth surface finish
Physically strong dielectric barrier against cut-through

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP K1100 Data Sheet

Technology	Silicone
Appearance	Blue-green
Reinforcement Carrier	Kapton
Total Thickness , ASTM D374	0.15 ± 0.025 mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D2240	90
Breaking Strength, ASTM D1458, KN/m	5
Elongation , 45º to warp and fill, ASTM D412,%	40
Tensile Strength, ASTM D412, MPa	35
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	6,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	4
Volume Resistivity, ASTM D257, ohm-meter	1×10¹²
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.1
Thermal Resistance Bergquist Flat Plate Test Method, ºC-in2 /W	0.3