BERGQUIST SIL PAD TSP PP900

BERGQUIST SIL PAD TSP PP900 is a fiberglass-reinforced insulator coated with a filled polyester resin.
BERGQUIST SIL PAD TSP PP900 is economical and designed for most standard applications.
Polyester-based, thermally conductive insulators from BERGQUIST provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (Telecomm and certain aerospace applications).
Poly-Pads are constructed with ceramic-filled polyester resin coating on either side of a fiberglass carrier or a film carrier.
The Poly-Pad family offers a complete range of performance characteristics to match individual applications.
BERGQUIST SIL PAD TSP PP900 is a polyester-based, thermally conductive insulating adhesive designed for silicone-sensitive standard applications.
BERGQUIST® SIL PAD TSP PP900 is a fiberglass-reinforced insulator coated with a filled polyester resin. It is a cost-effective solution designed for most standard applications. This product is well suited for applications requiring conformal coatings or where silicone contamination is a concern.

Thermal impedance: 1.13°C-in2/W (@50 psi)
Polyester based
For applications requiring conformal coatings
Designed for silicone-sensitive standard applications

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP PP900 Data Sheet

Technology	Polyester-based
Appearance	Tan
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.229mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-20 to 150ºC
Physical Properties
Hardness, Shore A, ASTM D2240	90
Breaking Strength, ASTM D1458, KN/m	18
Elongation , 45º to warp and fill, ASTM D412,%	10
Tensile Strength, ASTM D412, MPa	48
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	2,500
Dielectric Constant, ASTM D150 @ 1,000 Hz	5.5
Volume Resistivity, ASTM D257, ohm-meter	1×10¹¹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	0.9
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	5.85
@ 25 psi	5.61
@ 50 psi	5.13
@ 100 psi	4.59
@ 200 psi	4.12
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	1.62
@ 25 psi	1.35
@ 50 psi	1.13
@ 100 psi	0.86
@ 200 psi	0.61