Saint Gobain ThermaCool TC100U
Saint Gobain ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips.
- Thickness :0.381 mm,0.635 mm,0.79 mm,1.27 mm,1.575 mm
- Colors: White
Data Sheet
Features
Applications
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Saint Gobain ThermaCool TC100U Data Sheet
| Item | Data |
|---|---|
| Color | White |
| Thickness, nominal: in. | .015, .025, .032, .050, .062 |
| Thermal Conductivity: W/mK | 1.3 |
| Thermal Impedance: °C in.2 /W (1/16") | 1.25 |
| Break Strength: psi | 200 |
| Elongation: % | 350 |
| Hardness: Shore A | 65 |
| Dielectric Strength: volts/mil | 250 |
| Operating Temperature: °F | -80 to 400 |
Saint Gobain ThermaCool TC100U Features
- High bond strength and low thermal resistance in applications with uneven surfaces such as non-flat heat sinks
- Effectively bonds plastic BGA surfaces that may have silicone mold release contamination
- The unique silicone compound provides excellent bond strength to a wide range of substrates including plastic BGAs, anodized aluminum, and nickel-plated heat sinks which can eliminate mechanical fasteners and less secure tapes
- The resilient silicone compound provides good vibration isolation of components that also needs thermal transfer
- The product is supplied in an easy-to-use roll that ensures the correct amount of bonding and heat transfer material is provided without waste or need for special assembly equipment
Saint Gobain ThermaCool TC100U Applications
- Automotive Electronics
- Computers
- CD-ROM Cooling
- Electrical Insulation
- Military
- Medical
- Heat Pipe Assemblies
- Telecommunication
- Electronic modules for power devices for power supplies
Get in touch
+86-755-2301-3143
Location
No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
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