BERGQUIST SIL PAD TSP 1500

BERGQUIST SIL PAD TSP 1500, Electrically Insulating, Thermally Conductive Elastomeric Material

BERGQUIST® SIL PAD TSP 1500 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications.

Thermal impedance: 0.46ºC-in2 /W @ 50 psi
Silicone elastomer
Conformable material
Carrier Type: Fiberglass
Color: Green
Flame Rating: V-0
Operating Temperature: -60.0 - 200.0 °C
Standard Thickness: 0.24 mm
Technology: Silicone
Thermal Conductivity: 0.2 W/mK

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1500 Data Sheet

Technology	Silicone
Appearance	Green
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.254mm
Application	Thermal management, Thermally conductive adhesive
Operating Temperature Range	-60 to 200ºC
Physical Properties
Hardness, Shore A, ASTM D2240	80
Breaking Strength, ASTM D1458, KN/m	12
Elongation , 45º to warp and fill, ASTM D412,%	20
Tensile Strength, ASTM D412, MPa	7
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC	4000
Dielectric Constant, ASTM D150 @ 1,000 Hz	4
Volume Resistivity, ASTM D257, ohm-meter	1×10¹¹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	2
Thermal Performance vs. Pressure TO-220 Thermal Performance, ºC/W
@ 10 psi	3.54
@ 25 psi	3.18
@ 50 psi	2.68
@ 100 psi	2.4
@ 200 psi	2.22
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	0.72
@ 25 psi	0.57
@ 50 psi	0.46
@ 100 psi	0.38
@ 200 psi	0.32