BERGQUIST SIL PAD TSP 1600

BERGQUIST SIL PAD TSP 1600 is a thermally conductive, silicone-based, and highly compliant soft pad material that features minimal thermal resistance and maximum thermal performance.
BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass-reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures.

Carrier Film Thickness: 0.025 mm
Dielectric Breakdown Voltage: 3000.0 Vac
Dielectric Constant, @ 1kHz: 6.0
Flame Rating: V-0
Operating Temperature: -60.0 - 180.0 °C
Phase Change Temperature: 55.0 °C
Shore Hardness, ASTM D2240 Shore A:91.0
Standard Thickness:0.127 mm
Thermal Conductivity: 1.6 W/mK
Thermal Impedance, ASTM D5470 @ 50 psi: 0.45 °C-in²/W
Volume Resistivity: 1×10 Ohm m

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1600 Data Sheet

Technology	Silicone
Appearance	Gold
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.127 mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Hardness, Shore A, ASTM D2240	91
Elongation , 45º to warp and fill, ASTM D412,%	20
Tensile Strength, ASTM D412, MPa	12
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	3,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	6
Volume Resistivity, ASTM D257, ohm-meter	1×10¹º
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.6
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	3.56
@ 25 psi	3.01
@ 50 psi	2.45
@ 100 psi	2.05
@ 200 psi	1.74
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	0.92
@ 25 psi	0.6
@ 50 psi	0.45
@ 100 psi	0.36
@ 200 psi	0.29