BERGQUIST SIL PAD TSP 900

BERGQUIST SIL PAD TSP 900 is a silicone-based, thermally conductive insulator with excellent mechanical and physical characteristics.
BERGQUIST® SIL PAD TSP 900 is a silicone-based, fiberglass-reinforced, thermally conductive, and electrically insulating thermal interface solution. The fiberglass reinforcement provides excellent cut-through resistance and the thermal resistance of this product improves with age. This product is ideal for electrically isolating power sources from heat sinks.

Thermal impedance: 1.13°C-in2/W (@50 psi)
Excellent mechanical and physical characteristics
Flame retardant
Original Sil-Pad material
Carrier Type: Fiberglass
Color: Gray
Flame Rating： V-0
Operating Temperature:-60.0 - 180.0 °C
Standard Thickness:0.178 - 0.229 mm
Technology: Silicone
Thermal Conductivity:0.9 W/mK

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 900 Data Sheet

Technology	Silicone
Appearance	Gray
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.178, 0.229mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Hardness, Shore A, ASTM D2240	85
Breaking Strength, ASTM D1458, KN/m	5
Elongation , 45º to warp and fill, ASTM D412,%	54
Tensile Strength, ASTM D412, MPa	20
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	3,500 to 4,500
Dielectric Constant, ASTM D150 @ 1,000 Hz	5.5
Volume Resistivity, ASTM D257, ohm-meter	1×10¹¹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	0.9
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 0.007":
@ 10 psi	6.62
@ 25 psi	5.93
@ 50 psi	5.14
@ 100 psi	4.38
@ 200 psi	3.61
@ 0.009":
@ 10 psi	8.51
@ 25 psi	7.62
@ 50 psi	6.61
@ 100 psi	5.63
@ 200 psi	4.64
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 0.007":
@ 10 psi	1.82
@ 25 psi	1.42
@ 50 psi	1.13
@ 100 psi	0.82
@ 200 psi	0.54
@ 0.009":
@ 10 psi	2.34
@ 25 psi	1.83
@ 50 psi	1.45
@ 100 psi	1.05
@ 200 psi	0.69