BERGQUIST SIL PAD TSP 1680

BERGQUIST SIL PAD TSP 1680 is a mauve-colored, silicone pad material that is designed for high crushing and cut-through resistance typically found in high-pressure applications.
BERGQUIST® SIL PAD TSP 1680 is an electrically insulating, thermally conductive material that offers field-proven reliability.
This product is typically used on heavily machined metal surfaces where burrs and dents and other surface imperfections are commonly caused by extrusions or castings.

Thermal impedance: 1.07°C-in2/W at 50 psi
Excellent thermal cut-through resistance
Use in screw-mounted applications with cut-through problems
Technology： Silicone
Appearance： Mauve
Reinforcement Carrier： Fiberglass
Total Thickness：0.229mm
Application： Thermal management, Thermally conductive adhesives operating
Temperature Range：-40 to 150ºC

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1680 Data Sheet

Technology	Silicone
Appearance	Pink
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.229mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-40 to 150ºC
Physical Properties
Shore Hardness, ASTM D2240, Shore A	95
Hardness, Shore A, ASTM D2240	95
Elongation , 45º to warp and fill, ASTM D412,%	26
Tensile Strength, ASTM D412, MPa	10
Cut-Through Resistance , ASTM D412, Kg	340
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	4,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	6
Volume Resistivity, ASTM D257, ohm-meter	1×10¹º
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.2
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	5.48
@ 25 psi	5.07
@ 50 psi	4.52
@ 100 psi	4.04
@ 200 psi	3.56
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	1.51
@ 25 psi	1.22
@ 50 psi	1.07
@ 100 psi	0.89
@ 200 psi	0.53