BERGQUIST SIL PAD TSP 1800ST

BERGQUIST SIL PAD TSP 1800ST is a thermally conductive, fiberglass-reinforced, and soft pad material with natural tack on both sides.
BERGQUIST® SIL PAD TSP 1800ST is an elastomeric material with exceptional thermal performance. It is available in both sheet or roll form allowing excellent auto-dispensing and placement in high-volume assemblies. The pad material is repositionable and is designed to be placed between the electronic power device and the heat sink.

Thermal impedance: 0.23°C-in2/W (@50 psi)
Naturally tacky on both sides
Excellent thermal performance
Pad is repositionable
Carrier Type： Fiberglass
Color： Blue
Flame Rating： V-0
Operating Temperature：-60.0 - 180.0 °C
Standard Thickness：0.203 mm
Technology： Silicone

Data Sheet

Features

Applications

BERGQUIST SIL PAD TSP 1800ST Data Sheet

Technology	Silicone
Appearance	Blue
Reinforcement Carrier	Fiberglass
Total Thickness , ASTM D374	0.203mm
Application	Thermal management, Thermally conductive adhesive
Physical Properties
Operating Temperature Range	-60 to 180ºC
Physical Properties
Shore Hardness, ASTM D2240, Shore 00	75
Breaking Strength, ASTM D1458, KN/m	0.34
Elongation , 45º to warp and fill, ASTM D412,%	22
Tensile Strength, ASTM D412, MPa	1.6
Flammability Rating, UL 94	V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac	3,000
Dielectric Constant, ASTM D150 @ 1,000 Hz	6.1
Volume Resistivity, ASTM D257, ohm-meter	1×10¹¹
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K)	1.8
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi	1.54
@ 25 psi	1.52
@ 50 psi	1.51
@ 100 psi	1.49
@ 200 psi	1.46
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi	0.37
@ 25 psi	0.28
@ 50 psi	0.23
@ 100 psi	0.21
@ 200 psi	0.2