BERGQUIST GAP PAD TGP 2202SF

BERGQUIST GAP PAD TGP 2202SF is a high-performance, 2.0 W/m-K, thermally conductive gap-filling material.
The BERGQUIST GAP PAD TGP 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
BERGQUIST GAP PAD TGP 2202SF is specifically designed for silicone-sensitive applications.
The material’s construction features a 0.5 mil PET film on one side and a natural tack on the other.
The natural tack eliminates the need for an additional adhesive layer.

FEATURES AND BENEFITS

Thermal Conductivity: 2.0 W/m-K
Silicone-free formulation
Minimal compression set
0.5 mil film provides tack-free surface
The tacky side allows for ease of handling and placement

Data Sheet

Applications

BERGQUIST GAP PAD TGP 2202SF Data Sheet

Color	Gray
Density	2.8 g/cm³
Dielectric Constant, @ 1kHz	6
Flame Rating	V-0
Operating Temperature	-40.0 - 125.0 ℃
Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 掳C Shore 00	70
Standard Thickness	0.254 - 3.175 mm
Thermal Conductivity	2.0 W/mK
Volume Resistivity	1x10 Ohm m