BERGQUIST GAP PAD TGP 3004SF
BERGQUIST GAP PAD TGP 3004SF high performance, 3.0W/m-K, thermally conductive gap filling material.
BERGQUIST GAP PAD TGP 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive.
BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no-tack surface on one side and natural tack on the other side.
FEATURES AND BENEFITS
- Thermal Conductivity: 3.0 W/m-K
- Excellent thermal performance
- Silicone-free formulation
- 0.25 mil PET provides easy disassembly, leaving no residue
- The tacky side allows for ease of handling and placement
Data Sheet
Applications
BERGQUIST GAP PAD TGP 3004SF Data Sheet
| Carrier Type | 0.25 mil PET Film |
|---|---|
| Color | Gray: Light Gray |
| Density, Maximum Final | 3.2 g/cm³ |
| Flame Rating | V-0 |
| Operating Temperature | -40.0 - 125.0 ℃ |
| Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 掳C Shore 00 | 70 |
| Standard Thickness | 0.254 - 3.715 mm |
| Thermal Conductivity | 3.0 W/mK |
BERGQUIST GAP PAD TGP 3004SF Applications
- Hard disk drives
- HDD/SSD combination drives
- Medical devices
- Optical components
- Laser optics
- HDD case to tray
- Automotive electronics (HEV, NEV, batteries)
- Solar energy
- LED lighting
Get in touch
+86-755-2301-3143
Location
No. 57, Houting Community Second Industrial Zone,Shajing Street, Baoan District, Shenzhen,Guangdong Province, China
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