BERGQUIST GAP PAD TGP 1500 is a silicone-based, high compliance, soft gap pad which is both thermally conductive and electrically isolating.
BERGQUIST® GAP PAD TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has a low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
| Color | Black |
|---|---|
| Operating Temperature | ’-60.0 - 200.0 ℃ |
| Standard Thickness | 0.508 - 5.08 mm |
| Technology | Silicone |
| Thermal Conductivity | 1.5 W/mK |
| Young's Modulus, ASTM D575 | 310.0 KPa (45.0 psi ) |
